MM74HC132J vs TC74HCT00AFN feature comparison

MM74HC132J National Semiconductor Corporation

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TC74HCT00AFN Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TOSHIBA CORP
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 4850.05
CO2e (mg) 60140.616
Family HC/UH HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Length 19.43 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 32 ns 24 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Additional Feature NOT AVAILABLE IN JAPAN
Max I(ol) 0.004 A
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 24 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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