MM74HC132M vs 74HCT00NB feature comparison

MM74HC132M Rochester Electronics LLC

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74HCT00NB NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description SOP, DIP,
Pin Count 14
Reach Compliance Code unknown unknown
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e3
Length 8.6235 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 125 ns 29 ns
Seated Height-Max 1.753 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 5 1
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Qualification Status Not Qualified

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