MM74HC132MTC vs MC74HC132AND feature comparison

MM74HC132MTC Texas Instruments

Buy Now Datasheet

MC74HC132AND Motorola Mobility LLC

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MOTOROLA INC
Part Package Code TSSOP DIP
Package Description TSSOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 5 mm 18.86 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 32 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 4.69 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.62 mm
Base Number Matches 4 3
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 31 ns
Schmitt Trigger YES
Terminal Finish TIN LEAD

Compare MM74HC132MTC with alternatives

Compare MC74HC132AND with alternatives