MM74HC132MTCX vs 74HC00N,652 feature comparison

MM74HC132MTCX Rochester Electronics LLC

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74HC00N,652 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code TSSOP DIP
Package Description TSSOP, 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e4
Length 5 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 125 ns 135 ns
Seated Height-Max 1.2 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 7.62 mm
Base Number Matches 5 1
Manufacturer Package Code SOT27-1
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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