MM74HC132MTCX vs CD74HCT132EX feature comparison

MM74HC132MTCX National Semiconductor Corporation

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CD74HCT132EX Intersil Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP INTERSIL CORP
Package Description PLASTIC, TSSOP-14 DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
kg CO2e/kg 12.4 12.4
Average Weight (mg) 62.85 1630.6
CO2e (mg) 779.34 20219.441
Family HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 32 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm
Base Number Matches 5 3
Rohs Code No
HTS Code 8542.39.00.01
JESD-609 Code e0
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 50 ns
Schmitt Trigger YES
Terminal Finish Tin/Lead (Sn/Pb)