MM74HC132MTCX vs MC54HC00J feature comparison

MM74HC132MTCX Rochester Electronics LLC

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MC54HC00J Freescale Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Part Package Code TSSOP
Package Description TSSOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
Family HC/UH
JESD-30 Code R-PDSO-G14 R-XDIP-T14
JESD-609 Code e4 e0
Length 5 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 125 ns
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Base Number Matches 4 4
Source Content uid MC54HC00J
Package Equivalence Code DIP14,.3
Power Supplies 2/6 V
Qualification Status Not Qualified
Schmitt Trigger NO

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