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MM74HC132MTCX Rochester Electronics LLCBuy Now Datasheet |
TC74HC00AF-TP2 Toshiba America Electronic ComponentsBuy Now Datasheet |
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| Pbfree Code | Yes | No |
| Rohs Code | Yes | No |
| Part Life Cycle Code | Active | Active |
| Ihs Manufacturer | ROCHESTER ELECTRONICS INC | TOSHIBA CORP |
| Part Package Code | TSSOP | SOIC |
| Package Description | TSSOP, | SOP, |
| Pin Count | 14 | 14 |
| Reach Compliance Code | unknown | unknown |
| Family | HC/UH | HC/UH |
| JESD-30 Code | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 Code | e4 | e0 |
| Length | 5 mm | 10.3 mm |
| Logic IC Type | NAND GATE | NAND GATE |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 4 | 4 |
| Number of Inputs | 2 | 2 |
| Number of Terminals | 14 | 14 |
| Operating Temperature-Max | 125 °C | 85 °C |
| Operating Temperature-Min | -40 °C | -40 °C |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Code | TSSOP | SOP |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 | 240 |
| Propagation Delay (tpd) | 125 ns | 19 ns |
| Seated Height-Max | 1.2 mm | 1.9 mm |
| Supply Voltage-Max (Vsup) | 6 V | 6 V |
| Supply Voltage-Min (Vsup) | 2 V | 2 V |
| Supply Voltage-Nom (Vsup) | 4.5 V | 5 V |
| Surface Mount | YES | YES |
| Technology | CMOS | CMOS |
| Temperature Grade | AUTOMOTIVE | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD | Tin/Lead (Sn/Pb) |
| Terminal Form | GULL WING | GULL WING |
| Terminal Pitch | 0.65 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | NOT SPECIFIED |
| Width | 4.4 mm | 5.3 mm |
| Base Number Matches | 4 | 1 |
| HTS Code | 8542.39.00.01 | |
| Load Capacitance (CL) | 50 pF | |
| Qualification Status | Not Qualified | |
