MM74HC132MX vs 74HC132N feature comparison

	MM74HC132MX Texas Instruments Buy Now Datasheet	74HC132N NXP Semiconductors Buy Now Datasheet
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NATIONAL SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Part Package Code	SOIC	DIP
Package Description	SOP,	DIP, DIP14,.3
Pin Count	14	14
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-PDIP-T14
Length	8.65 mm	19.025 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	IN-LINE
Propagation Delay (tpd)	32 ns	38 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.75 mm	4.2 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Form	GULL WING	THROUGH-HOLE
Terminal Pitch	1.27 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	3.9 mm	7.62 mm
Base Number Matches	4	2
Pbfree Code		Yes
Rohs Code		Yes
ECCN Code		EAR99
JESD-609 Code		e4
Max I(ol)		0.004 A
Package Equivalence Code		DIP14,.3
Packing Method		BULK PACK
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Power Supplies		2/6 V
Prop. Delay@Nom-Sup		31 ns
Schmitt Trigger		YES
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Logic » Gates	Logic » Gates

MM74HC132MX Texas Instruments