MM74HC132MX vs 74HCT132N,652 feature comparison

MM74HC132MX Texas Instruments

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74HCT132N,652 NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 1630.6
CO2e (mg) 2675.92 20219.441
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 32 ns 50 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 5 1
Rohs Code Yes
Manufacturer Package Code SOT27-1
Samacsys Manufacturer NXP
JESD-609 Code e4
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 41 ns
Schmitt Trigger YES
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare MM74HC132MX with alternatives

Compare 74HCT132N,652 with alternatives