MM74HC132N vs HD74HC132RPEL feature comparison

MM74HC132N Fairchild Semiconductor Corporation

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HD74HC132RPEL Renesas Electronics Corporation

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Source Content uid MM74HC132N HD74HC132RPEL
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code 14LD, MDIP,JEDEC MS-001, .300" WIDE
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e3
Length 19.18 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 37 ns 25 ns
Propagation Delay (tpd) 125 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.95 mm
Base Number Matches 4 1
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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