MM74HC132NX
vs
74HCT132D-Q100
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
NEXPERIA
|
Package Description |
DIP,
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
kg CO2e/kg |
12.4
|
12.4
|
Average Weight (mg) |
1630.6
|
215.8
|
CO2e (mg) |
20219.441
|
2675.92
|
Family |
HC/UH
|
|
JESD-30 Code |
R-PDIP-T14
|
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
4
|
|
Number of Inputs |
2
|
|
Number of Terminals |
14
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Propagation Delay (tpd) |
158 ns
|
|
Supply Voltage-Max (Vsup) |
6 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Position |
DUAL
|
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Date Of Intro |
|
2017-02-01
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD SILVER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MM74HC132NX with alternatives
Compare 74HCT132D-Q100 with alternatives