MM74HC132NX vs 74HCT132N,652 feature comparison

MM74HC132NX onsemi

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74HCT132N,652 NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 1630.6
CO2e (mg) 20219.441 20219.441
Family HC/UH HCT
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 158 ns 50 ns
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Manufacturer Package Code SOT27-1
Samacsys Manufacturer NXP
JESD-609 Code e4
Length 19.025 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 41 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 4.2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

Compare MM74HC132NX with alternatives

Compare 74HCT132N,652 with alternatives