MM74HC132NX vs 935185800112 feature comparison

MM74HC132NX onsemi

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935185800112 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIP, TSSOP,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 62.85
CO2e (mg) 20219.441 779.34
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 158 ns 190 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code TSSOP
Pin Count 14
JESD-609 Code e4
Length 5 mm
Moisture Sensitivity Level 1
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 0.65 mm
Width 4.4 mm

Compare MM74HC132NX with alternatives

Compare 935185800112 with alternatives