MM74HC132NX vs CD54HCT132F3A feature comparison

	MM74HC132NX onsemi Buy Now	CD54HCT132F3A Texas Instruments Buy Now Datasheet
Source Content uid	MM74HC132NX	CD54HCT132F3A
Part Life Cycle Code	Active	Active
Package Description	DIP,	DIP, DIP14,.3
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HCT
JESD-30 Code	R-PDIP-T14	R-GDIP-T14
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-55 °C
Package Body Material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Propagation Delay (tpd)	158 ns	50 ns
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Base Number Matches	1	3
Pbfree Code		Yes
Rohs Code		No
Part Package Code		DIP
Pin Count		14
ECCN Code		EAR99
Factory Lead Time		6 Weeks
JESD-609 Code		e0
Length		19.56 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Package Equivalence Code		DIP14,.3
Packing Method		TUBE
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Power Supplies		5 V
Power Supply Current-Max (ICC)		0.04 mA
Prop. Delay@Nom-Sup		50 ns
Qualification Status		Not Qualified
Schmitt Trigger		YES
Screening Level		38535Q/M;38534H;883B
Seated Height-Max		5.08 mm
Terminal Finish		Tin/Lead (Sn/Pb)
Terminal Pitch		2.54 mm
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
Width		7.62 mm
	Logic » Gates	Logic » Gates

MM74HC132NX onsemi