MM74HC132NX vs CD74HCT132EX feature comparison

MM74HC132NX onsemi

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CD74HCT132EX Intersil Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ON SEMICONDUCTOR INTERSIL CORP
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 158 ns
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 50 ns
Schmitt Trigger YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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