MM74HC132NX
vs
HD74HC132P-E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
RENESAS ELECTRONICS CORP
Package Description
DIP,
DIP,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
158 ns
125 ns
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Part Package Code
DIP
Pin Count
14
JESD-609 Code
e4
Length
19.2 mm
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Seated Height-Max
5.06 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare MM74HC132NX with alternatives
Compare HD74HC132P-E with alternatives