MM74HC132NX
vs
M38510/65005BCA
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
QP SEMICONDUCTOR INC
|
Package Description |
DIP,
|
DIP,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
158 ns
|
29 ns
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
MIL-M-38510 Class B
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MM74HC132NX with alternatives
Compare M38510/65005BCA with alternatives