MM74HC132NX vs TC74HC132AFN-ELP feature comparison

MM74HC132NX onsemi

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TC74HC132AFN-ELP Toshiba America Electronic Components

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Package Description DIP, SOP, SOP14,.25
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 151.15
CO2e (mg) 20219.441 1874.26
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 158 ns 28 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code SOIC
Pin Count 14
JESD-609 Code e0
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Packing Method TR
Prop. Delay@Nom-Sup 28 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare MM74HC132NX with alternatives

Compare TC74HC132AFN-ELP with alternatives