MM74HC157J
vs
74HC157N,652
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP-16
|
0.300 INCH, PLASTIC, SOT38-4, DIP-16
|
| Reach Compliance Code |
compliant
|
compliant
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
19.43 mm
|
21.6 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
32 ns
|
38 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.7 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| Manufacturer Package Code |
|
SOT38-4
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Max I(ol) |
|
0.004 A
|
| Packing Method |
|
BULK
|
| Prop. Delay@Nom-Sup |
|
38 ns
|
|
|
|
Compare MM74HC157J with alternatives
Compare 74HC157N,652 with alternatives