MM74HC273CW
vs
54F273/BSA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
WAFER
|
DFP
|
| Package Description |
DIE,
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
F/FAST
|
| JESD-30 Code |
X-XUUC-N
|
R-CDFP-F20
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIE
|
DFP
|
| Package Equivalence Code |
DIE OR CHIP
|
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
FLATPACK
|
| Propagation Delay (tpd) |
170 ns
|
10.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Position |
UPPER
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| fmax-Min |
24 MHz
|
100 MHz
|
| Base Number Matches |
1
|
2
|
| Pin Count |
|
20
|
| Load Capacitance (CL) |
|
50 pF
|
| Number of Terminals |
|
20
|
| Power Supply Current-Max (ICC) |
|
50 mA
|
| Seated Height-Max |
|
2.54 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
6.9215 mm
|
|
|
|
Compare MM74HC273CW with alternatives
Compare 54F273/BSA with alternatives