MM74HC688WM
vs
5962-8681801RA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G20
|
R-GDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
MAGNITUDE COMPARATOR
|
IDENTITY COMPARATOR
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP20,.4
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Package Description |
|
DIP, DIP20,.3
|
| Pin Count |
|
20
|
| ECCN Code |
|
EAR99
|
| Family |
|
HC/UH
|
| Length |
|
24.195 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.0052 A
|
| Number of Bits |
|
8
|
| Number of Functions |
|
8
|
| Output Polarity |
|
INVERTED
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Power Supply Current-Max (ICC) |
|
0.08 mA
|
| Prop. Delay@Nom-Sup |
|
45 ns
|
| Propagation Delay (tpd) |
|
313 ns
|
| Screening Level |
|
MIL-STD-883
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7.62 mm
|
|
|
|
Compare MM74HC688WM with alternatives
Compare 5962-8681801RA with alternatives