MM74HC75J
vs
TC74HCT273AFW-TP1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
TOSHIBA CORP
|
| Package Description |
DIP, DIP16,.3
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDIP-T16
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Max I(ol) |
0.004 A
|
|
| Number of Bits |
2
|
8
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Prop. Delay@Nom-Sup |
32 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
20
|
| Family |
|
HCT
|
| Length |
|
12.8 mm
|
| Output Polarity |
|
TRUE
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Propagation Delay (tpd) |
|
38 ns
|
| Seated Height-Max |
|
2.7 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Trigger Type |
|
POSITIVE EDGE
|
| Width |
|
7.5 mm
|
| fmax-Min |
|
24 MHz
|
|
|
|
Compare TC74HCT273AFW-TP1 with alternatives