MM74HCT00J vs SN74HCT00DRE4 feature comparison

MM74HCT00J Texas Instruments

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SN74HCT00DRE4 Texas Instruments

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 19.43 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 25 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.02 mA
Prop. Delay@Nom-Sup 25 ns
Time@Peak Reflow Temperature-Max (s) 30

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Compare SN74HCT00DRE4 with alternatives