MM74HCT00MX vs 74HC00DB,112 feature comparison

MM74HCT00MX National Semiconductor Corporation

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74HC00DB,112 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description PLASTIC, SO-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Reach Compliance Code unknown compliant
kg CO2e/kg 12.4 12.4
Average Weight (mg) 151.15 149.35
CO2e (mg) 1874.26 1851.94
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 29 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 5 2
Rohs Code Yes
Part Package Code SSOP1
Pin Count 14
Manufacturer Package Code SOT337-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
JESD-609 Code e4
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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