MM74HCT00MX vs 8403701CX feature comparison

MM74HCT00MX onsemi

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8403701CX Motorola Mobility LLC

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Pbfree Code Yes
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer ONSEMI MOTOROLA INC
Package Description SOIC-14 DIP,
Manufacturer Package Code 751EF
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4
Length 8.6235 mm 19.56 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 NOT APPLICABLE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT APPLICABLE
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 29 ns 135 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.753 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT APPLICABLE
Width 3.9 mm 7.62 mm
Base Number Matches 5 5
Part Package Code DIP
Pin Count 14

Compare MM74HCT00MX with alternatives

Compare 8403701CX with alternatives