MM74HCT00N
vs
MC858L
feature comparison
| Rohs Code |
|
No
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
MOTOROLA INC
|
| Part Package Code |
|
DIP
|
| Package Description |
|
DIP, DIP14,.3
|
| Pin Count |
|
14
|
| Reach Compliance Code |
|
unknown
|
| HTS Code |
|
8542.39.00.01
|
| Family |
|
MC85
|
| JESD-30 Code |
|
R-GDIP-T14
|
| JESD-609 Code |
|
e0
|
| Logic IC Type |
|
NAND GATE
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
75 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP14,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Propagation Delay (tpd) |
|
30 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
DTL
|
| Temperature Grade |
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Base Number Matches |
|
1
|
|
|
|
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