MM74HCT273MTC vs TC74HCT273AF-TP1 feature comparison

MM74HCT273MTC Fairchild Semiconductor Corporation

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TC74HCT273AF-TP1 Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred End Of Life
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP TOSHIBA CORP
Part Package Code TSSOP SOIC
Package Description 4.40 MM, MO-153AC, TSSOP-20 SOP,
Pin Count 20 20
Manufacturer Package Code 20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e0
Length 6.5 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 21000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 46 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.8 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 5.3 mm
fmax-Min 21 MHz 24 MHz
Base Number Matches 3 1

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