MM74HCT540MTCX
vs
TC74HCT540AFW(TP1)
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
TOSHIBA CORP
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
TSSOP,
|
0.300 INCH, PLASTIC, SOIC-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
WITH DUAL OUTPUT ENABLE
|
WITH DUAL OUTPUT ENABLE; ENABLE TIME @ RL=1K
|
| Family |
HCT
|
HCT
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
|
| Length |
6.5 mm
|
12.8 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Propagation Delay (tpd) |
38 ns
|
33 ns
|
| Seated Height-Max |
1.2 mm
|
2.7 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
4.4 mm
|
7.5 mm
|
| Base Number Matches |
3
|
1
|
| Load Capacitance (CL) |
|
150 pF
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MM74HCT540MTCX with alternatives
Compare TC74HCT540AFW(TP1) with alternatives