MMA20312BVT1
vs
RMWB24001
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FAIRCHILD SEMICONDUCTOR CORP
|
Package Description |
3 X 3 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, CASE 2131-01, QFN-12
|
DIE OR CHIP
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Characteristic Impedance |
50 Ω
|
50 Ω
|
Construction |
COMPONENT
|
COMPONENT
|
Gain |
23.6 dB
|
13 dB
|
Input Power-Max (CW) |
14 dBm
|
11 dBm
|
JESD-609 Code |
e3
|
|
Mounting Feature |
SURFACE MOUNT
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
|
Operating Frequency-Max |
2200 MHz
|
24000 MHz
|
Operating Frequency-Min |
1800 MHz
|
17000 MHz
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Equivalence Code |
LCC12,.12SQ,20
|
DIE OR CHIP
|
Power Supplies |
5 V
|
4 V
|
RF/Microwave Device Type |
NARROW BAND MEDIUM POWER
|
WIDE BAND LOW POWER
|
Supply Current-Max |
77 mA
|
|
Surface Mount |
YES
|
|
Technology |
BIPOLAR
|
GAAS
|
Terminal Finish |
MATTE TIN
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-30 °C
|
|
|
|
Compare MMA20312BVT1 with alternatives
Compare RMWB24001 with alternatives