MMBD4448HSDW-H
vs
MMBD4448HSDW
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
FORMOSA MICROSEMI CO LTD
|
CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
|
Package Description |
R-PDSO-G6
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Application |
GENERAL PURPOSE
|
|
Configuration |
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-F6
|
Number of Elements |
4
|
4
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-65 °C
|
Output Current-Max |
0.25 A
|
0.25 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Dissipation-Max |
0.2 W
|
0.2 W
|
Rep Pk Reverse Voltage-Max |
80 V
|
80 V
|
Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
9
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOT-363
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MMBD4448HSDW-H with alternatives
Compare MMBD4448HSDW with alternatives