MMBT3906LP-7
vs
SMBT3906E6327
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
DIODES INC
|
SIEMENS A G
|
| Part Package Code |
DFN
|
|
| Package Description |
GREEN, LEADLESS, ULTRA SMALL, PLASTIC, DFN1006-3, 3 PIN
|
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.75
|
|
| Factory Lead Time |
8 Weeks
|
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Case Connection |
COLLECTOR
|
|
| Collector Current-Max (IC) |
0.2 A
|
0.2 A
|
| Collector-Base Capacitance-Max |
4.5 pF
|
|
| Collector-Emitter Voltage-Max |
40 V
|
40 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
30
|
80
|
| JESD-30 Code |
R-PBCC-N3
|
R-PDSO-G3
|
| JESD-609 Code |
e4
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
PNP
|
PNP
|
| Power Dissipation Ambient-Max |
1 W
|
|
| Power Dissipation-Max (Abs) |
1 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
AEC-Q101
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
300 MHz
|
250 MHz
|
| Turn-off Time-Max (toff) |
300 ns
|
300 ns
|
| Turn-on Time-Max (ton) |
70 ns
|
70 ns
|
| VCEsat-Max |
0.4 V
|
|
| Base Number Matches |
1
|
3
|
| Transistor Application |
|
SWITCHING
|
|
|
|
Compare MMBT3906LP-7 with alternatives
Compare SMBT3906E6327 with alternatives