MMBZ18VALT1G
vs
S23LC15
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ONSEMI
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
Part Package Code |
SOT-23 (TO-236) 3 LEAD
|
|
Package Description |
SOT-23, 3 PIN
|
SOT-23, 3 PIN
|
Pin Count |
3
|
|
Manufacturer Package Code |
318-08
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Breakdown Voltage-Max |
18.9 V
|
|
Breakdown Voltage-Min |
17.1 V
|
16.7 V
|
Breakdown Voltage-Nom |
18 V
|
|
Clamping Voltage-Max |
25 V
|
|
Configuration |
COMMON ANODE, 2 ELEMENTS
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
Forward Voltage-Max (VF) |
0.9 V
|
|
JEDEC-95 Code |
TO-236
|
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
1
|
Non-rep Peak Rev Power Dis-Max |
40 W
|
300 W
|
Number of Elements |
2
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.225 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
IEC-61000-4-2
|
|
Rep Pk Reverse Voltage-Max |
14.5 V
|
15 V
|
Reverse Current-Max |
0.05 µA
|
|
Reverse Test Voltage |
14.5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
AVALANCHE
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
5
|
Rohs Code |
|
No
|
Additional Feature |
|
ULTRA LOW CAPACITANCE
|
|
|
|
Compare MMBZ18VALT1G with alternatives
Compare S23LC15 with alternatives