MMUN2211LT1 vs BCR133E6327HTSA1 feature comparison

MMUN2211LT1 Motorola Semiconductor Products

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BCR133E6327HTSA1 Infineon Technologies AG

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Rohs Code No Yes
Part Life Cycle Code Transferred End Of Life
Ihs Manufacturer MOTOROLA INC INFINEON TECHNOLOGIES AG
Package Description TO-236AB, 3 PIN SMALL OUTLINE, R-PDSO-G3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.95
Additional Feature BUILT-IN BIAS RESISTOR RATIO IS 1 BUILT-IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 35 30
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 0.2 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 6 1
Pbfree Code Yes
Factory Lead Time 4 Weeks
Samacsys Manufacturer Infineon
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 10
Transition Frequency-Nom (fT) 130 MHz

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