MPC8250ACZQIHBC vs MPC8313CVRADDC feature comparison

MPC8250ACZQIHBC Motorola Mobility LLC

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MPC8313CVRADDC NXP Semiconductors

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Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516
Pin Count 516
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 64 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
Length 27 mm 27 mm
Low Power Mode NO YES
Number of Terminals 516 516
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 200 MHz 266 MHz
Supply Voltage-Max 1.9 V 1.05 V
Supply Voltage-Min 1.7 V 0.95 V
Supply Voltage-Nom 1.8 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 5 2
Rohs Code Yes
ECCN Code 3A991.A.2
Factory Lead Time 52 Weeks
Samacsys Manufacturer NXP
Clock Frequency-Max 66.67 MHz
JESD-609 Code e2
Moisture Sensitivity Level 3
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Equivalence Code BGA516,26X26,40
Peak Reflow Temperature (Cel) 260
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s) 40

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Compare MPC8313CVRADDC with alternatives