MPC8270ZQMIBA vs MPC8247CVRMIBA feature comparison

MPC8270ZQMIBA NXP Semiconductors

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MPC8247CVRMIBA NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516 BGA-516
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks 52 Weeks
Samacsys Manufacturer NXP NXP
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 266 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e2
Length 27 mm 27 mm
Low Power Mode NO
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 66.67 MHz
Supply Voltage-Max 1.6 V 1.575 V
Supply Voltage-Min 1.45 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC SoC
Base Number Matches 1 1

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Compare MPC8247CVRMIBA with alternatives