MPC8270ZQMIBA vs MPC8270VRUPEX feature comparison

MPC8270ZQMIBA NXP Semiconductors

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MPC8270VRUPEX

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Rohs Code No
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516
Reach Compliance Code not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 52 Weeks
Samacsys Manufacturer NXP
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 266 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B516
JESD-609 Code e0
Length 27 mm
Low Power Mode NO
Moisture Sensitivity Level 3
Number of Terminals 516
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA516,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Seated Height-Max 2.55 mm
Speed 66.67 MHz
Supply Voltage-Max 1.6 V
Supply Voltage-Min 1.45 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Base Number Matches 1

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