MPC850CZQ50BU vs MIP7965-668B1R feature comparison

MPC850CZQ50BU Freescale Semiconductor

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MIP7965-668B1R Cobham PLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC COBHAM PLC
Part Package Code BGA
Package Description 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256 BGA,
Pin Count 256
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 26
Bit Size 32 64
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 133 MHz
External Data Bus Width 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0
Length 23 mm 27 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm
Speed 50 MHz 668 MHz
Supply Voltage-Max 3.465 V 1.35 V
Supply Voltage-Min 3.135 V 1.25 V
Supply Voltage-Nom 3.3 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 23 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 3 1
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Operating Temperature-Max 110 °C
Operating Temperature-Min -55 °C
Temperature Grade OTHER

Compare MPC850CZQ50BU with alternatives

Compare MIP7965-668B1R with alternatives