MPC8548VJAQGB
vs
PCX8548EMVZFUAQGB
feature comparison
Part Life Cycle Code |
Active
|
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
Package Description |
BGA,
|
|
Reach Compliance Code |
unknown
|
|
HTS Code |
8542.31.00.01
|
|
JESD-30 Code |
S-PBGA-B783
|
|
JESD-609 Code |
e2
|
|
Length |
29 mm
|
|
Number of Terminals |
783
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA783,28X28,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Seated Height-Max |
3.38 mm
|
|
Supply Voltage-Max |
1.155 V
|
|
Supply Voltage-Min |
1.045 V
|
|
Supply Voltage-Nom |
1.1 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Terminal Finish |
TIN SILVER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
29 mm
|
|
uPs/uCs/Peripheral ICs Type |
SoC
|
|
Base Number Matches |
1
|
|
|
|
|
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