MPX5010DP vs MPX5010DP feature comparison

MPX5010DP NXP Semiconductors

Buy Now

MPX5010DP NXP Semiconductors

Buy Now
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description PLASTIC, UNIBODY PACKAGE-6 PLASTIC, UNIBODY PACKAGE-6
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 66 Weeks 66 Weeks
Samacsys Manufacturer NXP NXP
Accuracy-Max (%) 5% 5%
Additional Feature TEMPERATURE COMPENSATED TEMPERATURE COMPENSATED
Body Breadth 10.67 mm 10.67 mm
Body Height 28.7 mm 28.7 mm
Body Length or Diameter 29.46 mm 29.46 mm
Housing PLASTIC PLASTIC
Linearity (%) 5 % 5 %
Mounting Feature THROUGH HOLE MOUNT THROUGH HOLE MOUNT
Offset-Nom 0.20V 0.20V
Operating Current-Max 10 mA 10 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Range 0.20-4.70V 0.20-4.70V
Output Type ANALOG VOLTAGE ANALOG VOLTAGE
Port Type BARBED BARBED
Pressure Range-Max 1.45 Psi 1.45 Psi
Pressure Range-Min
Pressure Sensing Mode DIFFERENTIAL DIFFERENTIAL
Response Time 1000 µs 1000 µs
Sensors/Transducers Type PRESSURE SENSOR,PIEZORESISTIVE PRESSURE SENSOR,PIEZORESISTIVE
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Surface Mount NO NO
Termination Type SOLDER SOLDER
Base Number Matches 1 1