MRF10031
vs
MS2211
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MICROSEMI CORP
|
| Package Description |
FLANGE MOUNT, R-CDFM-F2
|
0.310 X 0.310 INCH, HERMETIC SEALED, METAL CERAMIC PACKAGE-2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
CASE 376B-02
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.75
|
|
| Additional Feature |
WITH EMITTER BALLASTING RESISTORS
|
HIGH RELIABILITY
|
| Case Connection |
BASE
|
BASE
|
| Collector Current-Max (IC) |
3 A
|
0.9 A
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
20
|
30
|
| Highest Frequency Band |
L BAND
|
L BAND
|
| JESD-30 Code |
R-CDFM-F2
|
R-CDFM-F2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
250 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation Ambient-Max |
110 W
|
|
| Power Dissipation-Max (Abs) |
110 W
|
25 W
|
| Power Gain-Min (Gp) |
9 dB
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MRF10031 with alternatives
Compare MS2211 with alternatives