MRF10502
vs
MS2208
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
M/A-COM TECHNOLOGY SOLUTIONS INC
|
MICROSEMI CORP
|
Package Description |
FLANGE MOUNT, R-CDFM-F2
|
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
CASE 355J-02
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
MACOM
|
|
Additional Feature |
WITH EMITTER BALLASTING RESISTORS
|
|
Case Connection |
BASE
|
BASE
|
Collector Current-Max (IC) |
29 A
|
27 A
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
20
|
10
|
Highest Frequency Band |
L BAND
|
L BAND
|
JESD-30 Code |
R-CDFM-F2
|
R-CDFM-F2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
250 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
1460 W
|
1360 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MRF10502 with alternatives
Compare MS2208 with alternatives