MS2554
vs
MX0912B251Y
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
0.400 X 0.400 INCH, HERMETIC SEALED, M218, 4 PIN
|
|
| Pin Count |
4
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Case Connection |
BASE
|
|
| Collector Current-Max (IC) |
17.8 A
|
15 A
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
15
|
|
| Highest Frequency Band |
L BAND
|
|
| JESD-30 Code |
S-CDFM-F2
|
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLANGE MOUNT
|
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
|
| Terminal Position |
DUAL
|
|
| Transistor Application |
AMPLIFIER
|
|
| Transistor Element Material |
SILICON
|
|
| Base Number Matches |
2
|
2
|
| Power Dissipation-Max (Abs) |
|
690 W
|
|
|
|
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