MS2601
vs
MS2601
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ASI SEMICONDUCTOR INC
|
MICROSEMI CORP
|
Package Description |
FLANGE MOUNT, S-CDFM-F2
|
FLANGE MOUNT, R-CDFM-F2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Case Connection |
BASE
|
BASE
|
Collector Current-Max (IC) |
0.45 A
|
0.45 A
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
10
|
10
|
Highest Frequency Band |
S BAND
|
S BAND
|
JESD-30 Code |
S-CDFM-F2
|
R-CDFM-F2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
11.5 W
|
11.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|