MSD601-ST1
vs
BCR158
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
SIEMENS A G
|
| Part Package Code |
SC-59
|
|
| Package Description |
CASE 318D-04, SC-59, 3 PIN
|
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
CASE 318D-04
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
SINGLE
|
SINGLE WITH BUILT-IN RESISTOR
|
| DC Current Gain-Min (hFE) |
290
|
70
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Polarity/Channel Type |
NPN
|
PNP
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
6
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.21.00.75
|
| Additional Feature |
|
BUILT-IN BIAS RESISTOR RATIO IS 21.3636
|
| Operating Temperature-Max |
|
150 °C
|
| Power Dissipation Ambient-Max |
|
0.2 W
|
| Transition Frequency-Nom (fT) |
|
200 MHz
|
| VCEsat-Max |
|
0.3 V
|
|
|
|
Compare MSD601-ST1 with alternatives
Compare BCR158 with alternatives