MSK162
vs
PA44
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MS KENNEDY CORP
|
CIRRUS LOGIC INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
SSOP,
|
| Pin Count |
8
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0001 µA
|
0.0002 µA
|
| Common-mode Reject Ratio-Nom |
94 dB
|
94 dB
|
| Input Offset Voltage-Max |
30000 µV
|
30000 µV
|
| JESD-30 Code |
S-CDIP-P8
|
R-PDSO-G24
|
| Length |
13.716 mm
|
15.9 mm
|
| Neg Supply Voltage Limit-Max |
-175 V
|
-175 V
|
| Neg Supply Voltage-Nom (Vsup) |
-150 V
|
-150 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
6.731 mm
|
3.6 mm
|
| Slew Rate-Nom |
20 V/us
|
40 V/us
|
| Supply Voltage Limit-Max |
175 V
|
175 V
|
| Supply Voltage-Nom (Vsup) |
150 V
|
150 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
MOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
PIN/PEG
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
22.86 mm
|
11 mm
|
| Base Number Matches |
1
|
2
|
| Unity Gain BW-Nom |
|
1600
|
|
|
|
Compare MSK162 with alternatives
Compare PA44 with alternatives