MT41K128M16JT-125:K vs MT41K128M16JT-125AIT:KT feature comparison

MT41K128M16JT-125:K Micron Technology Inc

Buy Now Datasheet

MT41K128M16JT-125AIT:KT Micron Technology Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Part Package Code BGA
Package Description TFBGA, BGA96,9X16,32
Pin Count 96
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36
Factory Lead Time 15 Weeks, 6 Days
YTEOL 5.1 2
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.225 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B96
JESD-609 Code e1 e1
Length 14 mm
Memory Density 2147483648 bit
Memory IC Type DDR3L DRAM DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min
Organization 128MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Power Supplies 1.35 V
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.012 A
Supply Current-Max 0.195 mA
Supply Voltage-Max (Vsup) 1.45 V
Supply Voltage-Min (Vsup) 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm
Base Number Matches 2 1

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Compare MT41K128M16JT-125AIT:KT with alternatives

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