MT41K128M16JT-125AIT:KT
vs
MT41K128M16JT-125AIT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| JESD-609 Code |
e1
|
|
| Memory IC Type |
DDR3L DRAM
|
DDR3L DRAM
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
Yes
|
| Package Description |
|
8 X 14 MM, LEAD FREE, FBGA-96
|
| HTS Code |
|
8542.32.00.36
|
| Access Mode |
|
MULTI BANK PAGE BURST
|
| Additional Feature |
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
|
R-PBGA-B96
|
| Length |
|
14 mm
|
| Memory Density |
|
2147483648 bit
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
96
|
| Number of Words |
|
134217728 words
|
| Number of Words Code |
|
128000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
128MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
|
1.2 mm
|
| Self Refresh |
|
YES
|
| Supply Voltage-Max (Vsup) |
|
1.45 V
|
| Supply Voltage-Min (Vsup) |
|
1.283 V
|
| Supply Voltage-Nom (Vsup) |
|
1.35 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
8 mm
|
|
|
|
Compare MT41K128M16JT-125AIT:KT with alternatives
Compare MT41K128M16JT-125AIT with alternatives