MT41K128M16JT-125M vs MT41K128M16JT-125MAIT feature comparison

MT41K128M16JT-125M Micron Technology Inc

Buy Now Datasheet

MT41K128M16JT-125MAIT Micron Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description 8 X 14 MM, LEAD FREE, FBGA-96 8 X 14 MM, LEAD FREE, FBGA-96
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 14 mm 14 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type DDR3L DRAM DDR3L DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128MX16 128MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.45 V 1.45 V
Supply Voltage-Min (Vsup) 1.283 V 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V 1.35 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 4 1

Compare MT41K128M16JT-125M with alternatives

Compare MT41K128M16JT-125MAIT with alternatives