MT47H128M16RT-25EAIT:CTR
vs
MT47H128M16HG-25EIT:A
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
Package Description |
,
|
11.50 X 14 MM, ROHS COMPLIANT, FBGA-84
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Memory IC Type |
DDR2 DRAM
|
DDR2 DRAM
|
Peak Reflow Temperature (Cel) |
260
|
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
84
|
HTS Code |
|
8542.32.00.36
|
Access Mode |
|
MULTI BANK PAGE BURST
|
Access Time-Max |
|
0.4 ns
|
Additional Feature |
|
AUTO/SELF REFRESH
|
JESD-30 Code |
|
R-PBGA-B84
|
JESD-609 Code |
|
e1
|
Length |
|
14 mm
|
Memory Density |
|
2147483648 bit
|
Memory Width |
|
16
|
Number of Functions |
|
1
|
Number of Ports |
|
1
|
Number of Terminals |
|
84
|
Number of Words |
|
134217728 words
|
Number of Words Code |
|
128000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
128MX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TFBGA
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Seated Height-Max |
|
1.2 mm
|
Self Refresh |
|
YES
|
Supply Voltage-Max (Vsup) |
|
1.9 V
|
Supply Voltage-Min (Vsup) |
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
11.5 mm
|
|
|
|
Compare MT47H128M16RT-25EAIT:CTR with alternatives
Compare MT47H128M16HG-25EIT:A with alternatives