MT49H32M18BM-25E:A vs MT49H32M18HT-25:A feature comparison

MT49H32M18BM-25E:A Micron Technology Inc

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MT49H32M18HT-25:A Micron Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Part Package Code BGA BGA
Package Description LEAD FREE, UBGA-144 LEAD FREE, FBGA-144
Pin Count 144 144
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 15 ns 20 ns
Additional Feature AUTO REFRESH AUTO REFRESH
Clock Frequency-Max (fCLK) 400 MHz 400 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e1 e1
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 95 °C
Operating Temperature-Min
Organization 32MX18 32MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA144,12X18,40/32 BGA144,12X18,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Power Supplies 1.5/1.8,1.8,2.5 V 1.5/1.8,1.8,2.5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Sequential Burst Length 2,4,8 2,4,8
Standby Current-Max 0.053 A 0.048 A
Supply Current-Max 0.98 mA 0.97 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1

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